Testing

Annex III, 6(a) and  6(a)-I

"Lead as an alloying element in steel for machining   purposes and in galvanised steel containing up to 0,35 % lead by weight."and"Lead as an alloying element in steel for machining purposes containing up to   0,35 % lead by weight and  in batch hot dip galvanised steel components containing up to 0,2 % lead by weight"

6(a): Lead as an alloying element in steel for machining purposes containing up to 0,35 % lead by weight and in galvanized steel containing up to 0,35 % lead by weight

— 21 July 2023 for category   8 in vitro  diagnostic medical devices;

— 21 July 2024 for category   9 industrial monitoring and control    instruments, and for category 11

6(a)-I: Lead as an alloying element in steel for machining purposes  containing up to 0,35 % lead by weight

Expires on 21 July 2024 for all categories

6(a)-II: Lead as an alloying element in batch hot dip galvanised steel components containing up to 0,2% lead by weight

Expires on 21 July 2026 for all categories

Annex III,6(b)/6(b)-  I

"Lead as an alloying element in aluminium containing   up  to 0,4 % lead by weight"and "Lead   as an alloying element  in aluminium   containing up to 0,4 % lead by weight,    provided it stems from lead-bearing aluminium scrap  recycling"

6(b)-I: Lead as an alloying element in aluminium containing up to 0,4% lead by weight provided it stems from lead-bearing aluminium scrap recycling

Expires 12 months after the decision for all   categories

6(b)-III: Lead as an alloying element in aluminium casting alloys containing up to 0,3% lead by weight provided it stems from leadbearing aluminium scrap recycling

Expires on 21 July 2026 for all categories

Annex III,  6(b)-II

"Lead as an alloying element in aluminium for   machining  purposes with a lead content   up to 0,4 % by weight"

6(b)-II: Lead as an alloying element in aluminium for machining purposes with a lead content up to 0,4% by weight.

Expires 18 months after the decision for all   categories

6(b)-IV: Lead as an alloying element in aluminium for machining purposes with a lead content up to 0,4 % by weight in gas valves  applied in category 1 EEE(large household appliances)

Expires on 31 December 2024

Annex III, 6(c)

"Copper alloy containing up  to 4 % lead by weight"

6(c): Copper alloy containing up to 4 % lead by  weight

Expires on 21 July 2026 for all categories

Annex III, 7(a)

“Lead in high melting temperature type solders (i.e.   lead-based alloys containing 85 % by weight or more lead)”

Lead in high melting temperature type solders (i.e.,lead-based alloys containing 85 % by weight or more lead) (excludes those in the scope of exemption 24)

For all categories except applications covered by   point 24 of this Annex,  expires on 21   July 2024

Lead in high melting temperature type solders (i.e., lead-based alloys containing 85 % by weight or more lead) when used for the following applications (excludes those in the scope of exemption 24): 

I) for internal interconnections for attaching die,or other components along with a die in semiconductor assembly with steady   state or  transient/impulse currents of 0.1 A or greater or blocking voltages beyond 10 V, or die edge sizes larger than 0.3 mm x 0.3 mm 

II) for integral (meaning internal and external)   connections of die attach in electrical and electronic components, if the thermal conductivity of the cured/sintered die-attach material is >35W/(m*K) AND the electrical conductivity of the cured/sintered die-attach material shall be >4.7MS/m AND solidus melting temperature has to   be above 260°C

III) In first level solder joints (internal or integral connections - meaning internal and external) for manufacturing components so that subsequent mounting of electronic components onto subassemblies (i.e., modules or sub-circuit boards or substrates or point to point soldering) with a secondary solder does not reflow the first level solder. This item excludes die attach applications and hermetic  sealings   

IV) In second level solder joints for the attachment of components to printed circuit board or lead frames:

1. in solder balls for the attachment of ceramic  ball-grid-array (BGA)

2. in high temperature plastic overmouldings (>220 °C) 

V) as a hermetic sealing material between: 

1. a ceramic package or plug and a metal case,  2. component terminations and an internal   sub-part 

VI) for establishing electrical connections between lamp components in incandescent reflector lamps for infrared heating or high intensity  discharge lamps or oven lamps VII) for audio transducers where the peak operating temperature exceeds 200°C

Applies to all categories except applications   covered by point 24 of  this Annex,   expires on 21 July 2026

Annex III, 7(c)-I

“Electrical and electronic components containing   lead  in a glass or ceramic other than   dielectric ceramic in  ca-pacitors,   e.g. piezoelectronic devices, or in a glass or ceramic matrix compound”

7(c)-I: Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound

Expires on 21 July 2024 for all categories

7(c)-V: Electrical and electronic components containing lead in a glass or glass matrix compound that fulfils the following functions:

1) protection and electrical insulation in glass beads of high voltage  diodes and glass layers for wafer on the basis of a lead-zincborate or a lead-silica-borate glass body*

2) for hermetic sealings between ceramic, metal and/or glass parts

3) for bonding purposes in a process parameter window for < 500°C combined with a viscosity of 1013,3 dPas (so called"glasstransition temperature")

4) used as resistance materials such as ink, with a resistivity range from 1 Ohms/square to 1 Mega Ohms/square, excluding trimmer potentiometers** 

5) used in chemically modified glass surfaces for   Microchannel  Plates (MCPs), Channel Electron Multipliers (CEMs) and Resistive Glass Products (RGPs).

Expires on 21 July 2026 for all categories

7(c)-VI: Electrical and electronic components containing lead in a ceramic that fulfils the following functions (excluding items covered under item 7(c)-II, 7(c)-III and 7(c)-IV of this annex):

1) piezoelectric lead zirconium titanate (PZT) ceramics

2) providing ceramics with a positive temperature coefficient (PTC)

Expires on 21 July 2026 for all categories

Annex III, 7(c)-II

“Lead in dielectric ceramic in capacitors for a   rated voltage of 125 V AC or 250 V DC or higher”

7(c)-II: Lead in dielectric ceramic in capacitors   for a rated voltage of 125 V AC or 250 V DC or higher

Does not apply to applications covered by point   7(c)-I and 7(c)-IV of this Annex.

Expires on 21 July 2026 for all categories